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SparkLAN’s new SiP and Wi-Fi modules are now ready to ship with multi-country regulatory compliance, including FCC, CE, IC, and MIC certifications.The certified product lineup includes WNFS-267AXI(BT), AP6676SDSR, AP5811SA, and AP6611S. These certifications ensure seamless integration for global markets.

The modules integrate advanced Wi-Fi 6/6E and Bluetooth 5.3 technologies, supporting tri-band connectivity (2.4GHz / 5GHz / 6GHz) with robust security and low power consumption. Designed for industrial reliability, all models operate within a wide temperature range of -40°C to 85°C, ensuring stable wireless performance in harsh environments. With form factors ranging from compact SiP designs to M.2 2230 and Type 1216 LGA modules, SparkLAN offers flexible wireless solutions for diverse embedded, AIoT, and industrial applications.

SparkLAN’s multi-country certifications accelerate time-to-market for connected products in regulated markets worldwide.