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SparkLAN @ Japan IT Week - Wireless M2M EXPO (May 14 ~16) 2014-04-24

SparkLAN @ Japan IT Week - Wireless M2M EXPO (May 14 ~16)

Taipei, Taiwan – April 17th, 2014 -- SparkLAN Communications, Inc., leading embedded wireless networking solution provider, will be showcasing full range of Embedded Wi-Fi modules, including the latest 802.11ac solution and pioneering Industrial-Grade Wi-Fi solution for industrial, enterprise, and commercial embedded market at Japan IT Week - Wireless M2M EXPO.

 

With high performance quality and wide temperature range (-40 ~ +80C), SparkLAN Industrial-Grade modules are suitable for applications range from wireless connectivity for medical, military, and aerospace applications, Industrial automation, communication in transportation, and more... SparkLAN latest 802.11ac Wi-Fi modules can be address for traditional consumer, commercial, to residential networking connections. Come visit us and have further discussion. We look forward to meeting you.


* Industrial-Grade Module
* 802.11ac PCIe
* 802.11ac USB
* 802.11ac AP Board

 

Japan IT Week - Wireless M2M EXPO
Show Date: 14 - 16 May 2014
Place: Tokyo Big Sight, Tokyo, Japan
Booth: West Hall, W2-22 

 

 

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